Guarded Heat Flow Meter: GHFM-01
GHFM-01 Guarded Heat Flow Meter is designed to test the thermal resistance and thermal conductivity of both homogeneous and heterogeneous materials.
It follows ASTM E1530-19 for testing thermal resistance and thermal conductivity of solids, such as metals, polymers, composites and paste from -20 °C to 310 °C. The Thermtest proprietary testing stack, replaces the traditional pneumatic movement with advanced motor control, which allows automated control of testing sample thickness, force or pressure applied.
Features:
Easy to Change Heat Flux Stack
No tools are required to change the lower Heat Flux Stack, which forms a calibrated Heat Flux Transducer.
Housing multiple thermocouples to monitor temperature for confirmation of steady-state condition of the temperature gradient across the sample is achieved
Housing multiple thermocouples to monitor temperature for confirmation of steady-state condition of the temperature gradient across the sample is achieved
Thickness Measurement
Our proprietary gimbal design has the advantage of either automatic determination of sample thickness for rigid materials or a user defined sample thickness for compressible materials.
Sample thickness is measured using digital optical encoder technology.
Sample thickness is measured using digital optical encoder technology.
Temperature Control
Optimally selected heaters cooled by heat exchangers matched with thermocouples are positioned in the upper and lower stack to accurately control plate temperatures.
Lateral heat loss is minimized with the use of a guard oven. Upper and lower plates along with guard oven temperatures are controlled by the convenient software.
Lateral heat loss is minimized with the use of a guard oven. Upper and lower plates along with guard oven temperatures are controlled by the convenient software.
Clamping Control
Plates automatically clamp together for optimum sample contact for rigid materials. When testing compressible materials, the desired height, force, or pressure is set in the software and the plate will automatically stop once desired sample height, or pressure is achieved.
Specifications
| Direction | Through-thickness |
|---|---|
| Thermal conductivity (W/m·K)* | 0.1 to 100 |
| Sample diameter (mm) | 50 to 50.8 |
| Sample thickness (mm) | Up to 25 | Thin-films down to 0.1 mm with optional software |
| Test time (minutes) | 40 to 60 |
| Accuracy | 3% |
| Repeatability | 1 to 2% |
| Temperature range (°C)** | -20 to 310 |
| Pressure (kPa | psi) | Automated up to 379 kPa (55 psi) |
|
*Above 60 W/m·K, the material should be a minimum of 12.5 mm thick **Chilled circulator included with each system |